Pulse Heat Reflow Soldering machine YSPP-1A for TCP and crimping FPC-(YSHP-1A)

1.Closed Loop PID temperature control with visible LCD display.

2.LCD display programmable pressure switch for precise force control.

3.Each heating cycle is triggered by a real time pressure sensor.

4. Floating thermode ensures consistent pressure and heat transfer between

thermode head and the parts to be joined.

5. Silicon rubber can be fitted in bonding Heat Seal Connectors between LCD

and PCB.

6.Standard workpiece holder is mounted on a linear guideway and designed

to allow for easy changeover and repeatable operation.

7. Parts registration is adjusted by micrometer and secured by vacuum lock.

Optional CCD system for fine pitch component.

Specification: