Flexible Modular Lead-free Wave Soldering Machine-Wave soldering

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Five Features

1.Compact structure and small footprint.

2.PC+PLC control system.

3.IR preheating, high thermal efficiency and uniform temperature.

4.Step motor control spraying, more stable and reliable.

5.Adopts small solder pot, reduces the cost.

Flexible Modular Lead-free Wave Soldering Machine 0

Built-in Spraying Device

Flexible Modular Lead-free Wave Soldering Machine 1

Drawer type module preheating unit

Flexible Modular Lead-free Wave Soldering Machine 2

Linkage inlet buffering

Flexible Modular Lead-free Wave Soldering Machine 3

Solder Pot with Cast iron Material

Flexible Modular Lead-free Wave Soldering Machine 4

1.Conveying system: Direct buffering input structure. Special stainless steel chain transmission, aluminum alloy rail unique design, durable;Conveying system: adopt segmental floating structure, effectively prevent guide rail deformation;

2.Preheating system: Drawer-type energy-saving design.IR preheating,PID mode temperature control ,the temperature accuracy can reach to ±2℃;the dropping temperature between preheating zone and soldering zone is ≤5℃；

3.Flux spraying system:Adopt precision control valve for digital regulation, convenient management. Nozzle movement is controlled by stepping motor.Flux automatic pressure supply, can make the spray flow quickly reach saturation, top exhaustin, filtration system;

4.The solder pot adopts external heating, it is made of cast iron, the inner surface is anticorrosive treatment, with two low-flow nozzle and low oxidation design;

5.Forced air cooling system；

6.PC+PLC control system. Windows7 operation system with Chinese/English operation interface. Processing profile and data auto saving function.Alarm for detecting the flux and solder level.

Flexible Modular Lead-free Wave Soldering Machine 5

01 Buffer system

02 Exhaust fan

03 Flux spraying system

04 Pre-heater

05 Solder pot lifting unit

06 Dual wave solder pot

07 Angle adjustment controller

08 Cooling system

09 Finger cleaning system

10 LCD

Model No.	YSL-300E	YSL-320E
Dimension: LWH(mm)	338512401540	338511901540
Weight	Approx.1150kg	Approx.1100kg
Power Supply	3PH 380V 50HZ	3PH 380V 50HZ
Start up Power	28KW	27KW
Normal Running Power	7KW	6.7KW
Control System	PC+PLC
Spraying movement	Step motor
Spraying Pressure	0.2Mpa~0.4Mpa
Flux Flow Control	Option
Auto Flux Filling	Standard
Exhausting	Top exhaust	/
Exhausting Pipe Diameter(mm)	Φ250
Exhaust fan power	370W	/
Preheating Mode	IR
Temperature Control Mode	PID
Preheating Zone Quantity	2
Preheating Zone Length(mm)	1500
Preheating Temperature Range	Room temperature~200℃
Warm-up Time(min)	Approx.12min(setting: 150℃)
Width(mm)	50~300
PCB Conveying Direction	L→R( Option:R→L)
Conveying Speed(mm/min)	500~1800
Conveying Height(mm)	750±20
Available Component Height(mm)	Top120 Bottom15
Conveying Speed Control Mode	Closed loop stepless speed regulation by inverter
Finger	Spring Pressing Finger;D-40 Type Finger;Double-hook Finger;Heavy type double hook finger(Options)

Conveying Angle	4~6°
Solder Pot Type	Mechanical
Solder Pot Material	Casting Iron material
Wave Height Adjustment	Digital Control by PC
Cooling type	Air cooling	/
Solder Pot Heating Power	9KW	220V 9KW
Max Solder Pot Temperature	300℃
Solder Pot Capacity	Approx.350kg
Wave Driving Power	180W*2 3PH 220 VAC
Solder Pot Warm-up Time	Approx.150min(setting: 250℃)
Temperature Control Mode	PID
Finger Cleaning System	Brush	/

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