Wave soldering
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Temperature Profile → Process Management


Completely and professionally Achieve Zero Defect of Soldering


This device mainly used in analyzing data and process index to help decide whether the wave soldering is in a suitable condition for manufacturing,therefore,greatly reduces the number of defects.


Reduce the quantity of temperature measurement board,taking place of conventional temperature measurement board’s singal temperature testing method,and provide different process index testing methods,such as drip flake time,parallelism,depth/chain speed.


Wave Explorer 0 Wave Explorer 1


Wave Explorer 2 Wave Explorer 3


Wave Explorer technical parameter:

Model YSL-UP6E4+C YSL-R6E4-DC YSL-SDT4-ME
Frame size W=160MM/235MM/260MM/360MM/460MM;(optional)L=380mm,H=35mm;The normal width of the frame is 160mm and 235mm.
Recorder size(mm) 152(L)*93(W)*17(H) 142(L)*62(W)*15(H)
Test Result Reading Method USB to PC, software analysis automatically. LCD displays the result immediately.
/USB to PC, software analysis automatically.
Temperature Channel No 6 EA
Tin Touching Channel No 3 physical sensing channels
Speed Channel No 1 EA
Accuracy Temp:±0.8℃ Tin touching Time:±0.01S Speed:<±1cm/min Temp:±0.5℃ Tin touching Time:±0.01S Speed:<±1cm/min
Resolution Temp:±0.25℃ Tin touching Time:0.01S Speed:0.1cm/min Temp:±0.1℃ Tin touching Time:0.01S Speed:0.1cm/min
Sample Frequency 0.1-32S,Adjustable 0.1-400S,Adjustable
Temperature Measuring Range 0-300℃
Thermocouple Type K Type
Battery Rechargeable battery
Stand-by Time Super power saving design, standby for 30 days Super power saving design, standby for 280 days
Data Interface Mini USB2.0 Mini USB
Software Environment Microsoft Windows 2000/XP/WIN7/WIN8(32/64bit)
Software Language English, simplified Chinese, traditional Chinese


Wave Explorer:

1.Used in wave soldering temperature test and drip flake test.

2.Can be used to test acailable space of solder pot for solder pin.

3.Maximum uniformity during preheating.

4.Preheating peak temperature uniformity.

5.Temperature uniformity before dipping tin.

6.A drop in temperature before dipping tin.

7.Tin temperature uniformity.

8.Tin dipping parellelism.

9.Drip flake time.

10.Drip flake depth.

11.Tin wave height can be adjusted accurately.

12.Test tin temperature accurately.

13Chain speed.


Wave Explorer 4


BL-300 plug-in assembly line                                BF-350 Buffer conveyor


Wave Explorer 5


UB-350 PCB Exhaust Device(imporous belt)    Auto filling with solder tin and solder bar


Options For Wave Soldering System

Fluxer coating:1.Partial selective spraying

Flowmeter:1.Glass rotameter;2.Electronic digital display flowmeter;3.Flux closed loop control;

Conveyor system:1.Electrical width adjustment.

Solder pot:1.Materials for solder container: a.Casting iron; b.Titanium alloy;

2.Electric control solder pot movement.

Solder auto-feeding system Local Nitrogen safety device.

Double rail wave soldering(Back to Back)

MES interface

Barcode reader:1.Scan the bar code on the jig or PCB.

Cooling type:1.Water cooling chiller

Preheating system:4 sections of preheating can be customized,and the length is 2.3m.

Note:Some options are mainly used for the configuration specified types.Please make sure before ordering for manufacturer's convenience.


Wave Explorer 6 Wave Explorer 7


Electronic digital display flowmeter     Glass gauge flow meter


Wave Explorer 8 Wave Explorer 9


Water cooling chiller                       Four sections of preheating

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