Full Automatic solder paste Printer YSL-510H-Wave soldering

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Features

1.Perfect solution for large size product printing

2.Simple calibration and maintenance

3.Stable printing quality

4.Independent developed image processing software

Full Automatic Screen Printer YSL-510H 0

Overall diagram

1.Machine housing module

2.CCD image capture module

3.Stencil lifting module of Z-axis

4.Squeegee printing module

5.Cleaning module

6.Platform fine adjustment module

7.Rail and conveyor module

8.Three color warning lamp

9.Display and input device

Full Automatic Screen Printer YSL-510H 1

Technical parameters

Parameter		YSL-120
Basic Parameters	Screen Frame Size(mm)	650(×)×5500(Y)-737(×)×737(Y)
	Screen Frame Size(mm)	Thickness∶ 20-40mm
	Min PCB(mm)	50(×)×50(Y)mm
	Max PCB(mm)	510(X)×510(Y)
	Thickness	0.2mm～6mm( Use jig when pcb less than 0.4mm)
	Curve	<1%(Diagonal measurement)
	PCB backside Part Height	18mm
	Conveyor height	900±40mm
	Support	Magnetic support,Magnetic piece,Vacuum chamber
	Clamp	Side clamp and top clamp
	Edge distance	PCB process edge ≥2.5mm
	Conveyor speed	0~1500mm/sec,increment 1mm
	Conveyor belt	U type belt
	Stopper method	Air cylinder
	Stopper position	Set the PCB stopper position according to the size of board
	Set by software	Software Settings
Print System	Print speed	5-200mm/s adjustable
	Print head	Step motor drive scraper lifting
	Scraper	Steel scraper,rubber scraper(option)
	Scraper angle	60°
	Scraper pressure	0~20kg
View System	Substrate Separation	Three-section Substrate Separation；Speed∶0.1-20mm/s；Distance∶0-20mm
	Alignment position method	Mark Automatic aligning
	Camera	Germany BASLER,1/3”CCD,640*480pixel,pixel size 5.6μmx5.6μm
	Acquire image method	Upper/under double photo
	Camera light	Coaxial light,Ring light four kinds light can adjustable
	View range	9mm*7mm
	Mark dimensions	Diameter or Side length 1mm~2mm,allowable offset 10%
	Mark shape	Cir,Rec,or rhombus etc
	Mark position	PCB dedicated mark or PCB pad
	2D detection	/
Accuracy	Table adjusting range	X=±10mm,Y=±10mm,0=±2°
	Positional accuracy	±0.01mm
	Printing accuracy	±0.015mm
Time	Cycle time	<7.5 exprint,cleaning time)
	Convert line time	<5min
	Programming time	<10min
Control System	Computer configuration	Industrial PC,Windows official system
	System language	Chinese /English
	Pre and next machine connection	SMEMA
	User authorization	User PW and Senior PW set
Cleaning System	Cleaning system	Dry and Wet(standard),vacuum model(optional)
Cleaning System	Liquid level detection	Liquid level auto alarm detection
Power Parameters	Main power supply	AC220V±10%50/60HZ Single phase
	Total power	About 3kw
	Main air supply	4.5～6kgf/cm2
	Machine weight	About 1300Kg
	Machine dimensions	1350(L)×1625(W)×1535(H)mm
Option	Pneumatic top clamp	Standard
	Top clamp + side clamp	For PCB(thickness≤1mm)
	Vacuum adsorption and clean	For PCB(thickness≤1mm)and FPC
	Auto tin added	/
	Auto loading and unloading	/
	Flexible and universal support	For the Double-sided PCB(PCB backside parts Height ≤9mm)
	Automatic positioning of screen frame	Standard
	PCB board thickness movement adjustment function	/
	Squeegee pressure feedback function	/
	Air condition	Customer can buy by themselves
	The rest of solder paste on the stencil monitoring system	/
	SPI close loop	SPI close loop
	UPS power off protection	UPS 15 min power off protection
	Industry 4.0	Bar code trace function,Production analysis,etc