Multilayer PCB Singulation Equipment

Multilayer PCB Singulation Equipment Product Description:

Model:           YSPEL
Size(mm):         730 X 810 X 1700
Power supply(v):  110/220
Depression(Pa):   0.45-0.70
Weight(Kg):       530/700

FPC /PCB punching (YSPL)
1.Depaneling PCB/FPC by means of punching dies, to avoid micro-cracks caused by manual. 
2.Cast iron framework for rigidity. Punching dies are changeable. Easy set up of punching dies. 
3.Moveable lower die for easy loading and unloadingPCB punch die| FPC die| PCB punch mold| FPC mould