Equipment operation description
The main parameters of the hot press equipment are: temperature, time and pressure. If these three factors are controlled, the welding products will be stable. Hot press
Generally, PCB / FPC / FFC products are connected with each other by solder to achieve functions.
For welding products, it is very important to set the above parameters accurately. A good solder joint can make two solder joints fully welded
Appearance: molten tin occurs on the surface of two parts. Only when the above parameters are effectively cooperated can good products be welded.
FPC is composed of two layers of polyimide and copper platinum. The operating temperature scale of FPC is 130 to 200 degrees. It can be full
Taste up to 300 ℃ short time welding temperature. Since PCB and FPC will bring heat dissipation effect to the indenter during welding
(FPC and PCB will absorb heat. When the indenter is pressed down, due to the convection between the data to be welded and the air around the indenter, the indenter will
Heat dissipation). In addition, the thickness of FPC is between 0.02 and 0.12, so the loss of 50 to 80 degrees may occur when reaching the welding surface
Therefore, the loss temperature should be added to the set temperature (solder melting point plus loss temperature)
Parameter value and its setting scale:
1、 Setting of heating speed.
There are 8 gears in the heating speed range (gear 1 to gear 8). Gear 1 is the fastest and gear 8 is the slowest. Its setting is consistent with the width of the pressure head
of Slow heating gear (i.e. gears 6, 7 and 8) is used for narrow head (10mm), and fast heating gear (i.e. gears 1, 2 and 3) is used for wide head (e.g. 80mm). 2、 Temperature and time setting: the temperature setting is divided into three stages: preheating, welding and cooling.
1. Setting of preheating temperature in the first stage: make the solder point of the solder pad reach the melting point. The setting value is about the melting point temperature of tin. Lead free
About 230 degrees There is lead at about 180 degrees The time is set at 2 to 4 seconds. The advantages of preheating setting are:
1) It takes a few seconds for the temperature of the indenter to rise to the welding temperature (including the set time of holding the temperature). During this time, the welding is assisted
Agent activation, by removing the oxide layer to improve the melting of tin. Preheating is generally used in large products with more heat dissipation, or when soft
Weak substrates (such as ceramics) require more controlled heating to avoid cracking
2) When the second stage is heated, the tin of the solder pad can move well and smoothly back and forth. Otherwise, when the second stage is heated
The head suddenly rises to the melting temperature of tin, causing the solder on the pad tin to melt suddenly under pressure, and the pad
The low temperature at both ends makes the tin unable to move back and forth, resulting in short circuit due to left and right movement
2. Setting of the heating temperature of the second stage: the FPC and PCB are completely connected together, and the setting value is based on the raw materials to be welded
It depends Generally, the lead content is about 230 to 320 degrees Lead free is about 280 to 350 degrees. Due to different products,
The size of the indenter is different, resulting in different heat dissipation speed Set the temperature according to the heat dissipation
Note: when the electrodeposited copper of FPC is below 0.03mm, the temperature of the two sections should not be set too high. It is probably after the tin is completely melted
The melting temperature is enough If the temperature is too high, the temperature transmitted to the welding surface through FPC will also be too high, resulting in strong activity of tin
Mobility Simple formation of short circuit and tin bead. And the product will change color due to high temperature. If the temperature is set too low, it will cause snowflake
Welcome customers to come or send samples to test machine for evaluation!
[old brand of board splitting machine, yushunli is the first to be promoted] "yushunli board splitting machine" Suzhou yushunli Kunshan Dongguan Chang'an yushunli automation equipment Co., Ltd. specializes in developing milling cutter type board splitting machine, PCBA router, LED board splitting machine, light bar board splitting machine, Punch Board splitting machine, FPC punch board splitting machine, PCB board splitting machine, PCB circuit board splitting machine, curve board splitting machine, pneumatic board splitting machine, circuit board splitting machine, PCB cutting machine, PCB Gong board machine, aluminum substrate board splitting machine, walking knife board splitting machine, Automatic plate splitting machine, curve plate splitting machine, etc. The equipment is mainly used in various soft and hard PCB boards, FR4 / fr6 PCB, soft FPC, LED light strip, LED light strip, aluminum substrate, copper substrate stamping and splitting machine, etc. of mobile phone tablet and other communication digital electronics, household appliances, LED lighting, security electronics and other related electronic industries.
Suzhou yushunli Electronics Co., Ltd. South China address: (Headquarters)
Address: No. 10, Shanquan Road, yongtou village, Dongguan City, Guangdong Province
Ms. Liu: 13862072520
East China address: Address: No. 1068, Jinyang East Road, Kunshan City, Suzhou City, Jiangsu Province (Guorui Industrial Park)
Mr. Cao: 13450659407
Email / mail: email@example.com
Business scope: laser substrate splitting machine, full-automatic milling cutter splitting machine, online PCB router machine, PCB, FPC, substrate, copper substrate, aluminum substrate cutting and splitting die, stamping splitting machine, splitting machine, non-standard automatic customized full-automatic MCPCB splitting machine # font automatic splitting machine FPC laser splitting equipment light bar splitting machine FPC splitting machine PCB board splitting machine V cut blanking machine punch splitting machine, substrate pulse welding machine, substrate wiring welding machine, Substrate optical device module hot press